Supply Fccl Polyimide/Pi Flexible Copper Clad Laminate

Product Details
Customization: Available
Structure: Single-Sided FPC
Material: Polyimide
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Plant Area
>2000 square meters
OEM/ODM Availability
Yes
  • Supply Fccl Polyimide/Pi Flexible Copper Clad Laminate
  • Supply Fccl Polyimide/Pi Flexible Copper Clad Laminate
  • Supply Fccl Polyimide/Pi Flexible Copper Clad Laminate
  • Supply Fccl Polyimide/Pi Flexible Copper Clad Laminate
  • Supply Fccl Polyimide/Pi Flexible Copper Clad Laminate
  • Supply Fccl Polyimide/Pi Flexible Copper Clad Laminate
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Basic Info.

Model NO.
FCCL
Application
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive
Anisotropic Conductive Adhesive
Flame Retardant Properties
V2
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Polyimide
Brand
Slp
Transport Package
Carton Box
Specification
25cm*50m
Trademark
Shenglongpan
Origin
Jiangsu
HS Code
3920999001
Production Capacity
5000000PCS/Month

Product Description

Flexible copper cladding plate is widely used in aerospace equipment, navigation equipment, aircraft instruments, military guidance system and mobile phone, digital camera, digital camera, automobile satellite orientation device, LCD TV, notebook computer and other electronic products.Due to the rapid development of electronic technology, the output of flexible copper clad plate is growing steadily and the production scale is expanding. Especially, the demand and growth trend of flexible copper clad plate based on polyimide film with high performance is more prominent.
Supply Fccl Polyimide/Pi Flexible Copper Clad LaminateSupply Fccl Polyimide/Pi Flexible Copper Clad Laminate
Supply Fccl Polyimide/Pi Flexible Copper Clad Laminate

Product Technical Datasheet              

 
Property Spec AHESR2080 AHESE3201 AHESE2200 Test Method
Product structure -----       -----
Thickness (um) ±3 76 130 88 APLUS Spec
Peel Strength (kgf/cm) A Common Cu >0.7 ----- >1.0 >0.8 IPC-TM-650 2.4.9
Double-sided bright Cu >0.3 >0.51 ----- -----
MEK
/10min
Common Cu >0.5 ----- >0.9 >0.7
Double-sided bright Cu >0.3 >0.44 ----- -----
Dimensional Stability (%) MD ±0.10% <0.06 <0.06 <0.02 IPC-TM-650 2.2.4
TD <0.03 <0.04 <0.03
Solder Resistance 230°C×30S Pass Pass Pass IPC-TM-650 2.4.13
UL Flame class UL HB ----- Pass Pass UL 94
Shelf Life <30°C/70%RH 1 year 1 year 1 year APLUS Spec
Supply Fccl Polyimide/Pi Flexible Copper Clad LaminateSupply Fccl Polyimide/Pi Flexible Copper Clad LaminateSupply Fccl Polyimide/Pi Flexible Copper Clad Laminate

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